Semiconductor device and method for making the same

ABSTRACT

A semiconductor device includes a plurality of semiconductor fins, at least one gate stack, a refill isolation, and an air gap. Each of the semiconductor fins extends in an X direction. Two adjacent ones of the semiconductor fins are spaced apart from each other in a Y direction transverse to the X direction. The at least one gate stack has two stack sections spaced apart from each other in the Y direction. The stack sections are disposed over two adjacent ones of the semiconductor fins, respectively. The refill isolation and the air gap are disposed between the stack sections.

BACKGROUND

With the dramatic development of the semiconductor manufacturingtechnology, the semiconductor integrated circuit (IC) chip can be scaleddown with an increased functional density (i.e., the number ofelectrical devices per chip area). For example, in a semiconductor ICchip with three-dimensional transistors, FEOL (front-end-of-line) metalgate (MG) structure is being cut to obtain a plurality of metal gateportions, and each of the metal gate portions can be used in anindividual transistor. Nevertheless, in order to meet application needs,improvement of the electrical characteristics of a semiconductor IC chipis still required, such as lowering device capacitance for reducingresistive-capacitive delay.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates a process flow for making a semiconductor device inaccordance with some embodiments.

FIGS. 2 to 31 illustrate intermediate stages of the method formanufacturing the semiconductor device in accordance with someembodiments as depicted in FIG. 1.

FIG. 32 illustrates a schematic view of a semiconductor structure inaccordance with some embodiments.

FIG. 33 illustrates a schematic view of a semiconductor structure inaccordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the disclosure.Specific examples of components and arrangements are described below tosimplify the present disclosure. These are, of course, merely examplesand are not intended to be limiting. For example, the formation of afirst feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

FIG. 1 illustrates a process flow for making a semiconductor device inaccordance with some embodiments. FIGS. 2 to 18 illustrate schematicviews of intermediate stages in the formation of a semiconductorstructure in accordance with some embodiments as depicted in FIG. 1.

FIG. 2 is a schematic top view of a semiconductor structure 20 inaccordance with some embodiments. FIGS. 3 and 4 are schematiccross-sectional views taken along line A-A in a Y direction and line B-Bin an X direction of FIG. 2, respectively. FIG. 5 is a partiallyenlarged view of FIG. 3.

Referring to FIGS. 2 to 5, the semiconductor structure 20 is provided.This process is illustrated as process 202 in the flow chart 200 shownin FIG. 1. The semiconductor structure 20 includes a substrate 21, aplurality of isolation regions 22, a plurality of semiconductor fins 23,a plurality of gate stacks 24, a first dielectric layer 25, and aplurality of gate spacers 26. The substrate 21 may be an elementalsemiconductor substrate or a compound semiconductor substrate. Theelemental semiconductor substrate may be made from single species ofatoms, such as silicon (Si), germanium (Ge), or other suitablematerials. The compound semiconductor substrate may include two or moreelements, such as silicon carbide (SiC), silicon germanium (SiGe),gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide(InP), indium arsenide (InAs), indium antimonide (InSb), galliumarsenide phosphide (GaAsP), aluminum indium arsenide (AlInAs), aluminumgallium arsenide (AlGaAs), gallium indium arsenide (GaInAs), galliumindium phosphide (GaInP), gallium indium arsenide phosphide (GaInAsP) orother suitable materials. In some embodiments, the substrate 21 may bedoped with a suitable p-type dopant, such as boron (B), aluminum (Al),gallium (Ga) or other suitable materials, or may alternatively be dopedwith a suitable n-type dopant, such as phosphorous (P), antimony (Sb),arsenic (As) or other suitable materials. The isolation regions 22 maybe formed in the substrate 21. In some embodiments, the isolationregions 22 may be shallow trench isolation (STI) regions that are formedby etching the substrate 21 to form a plurality of trenches (not shown),and then filling the trenches with a dielectric material to thereby formthe STI regions. The dielectric material for forming the STI regions maybe made of a suitable material, such as silicon oxide, silicon nitride,silicon oxynitride, low dielectric constant (k) material, high-kmaterial, other suitable materials, or any combination thereof. Thedielectric material may be filled in the trenches using, for example,atomic layer deposition (ALD), chemical vapor deposition (CVD), spin-oncoating or other suitable techniques. In some embodiments, the isolationregions 22, which cooperatively serve as an isolation structure, may bedisposed on the substrate 21 among lower portions of the semiconductorfins 23 (see FIG. 3). The semiconductor fins 23 are defined among theisolation regions 22 and extend in the X direction. Two adjacent ones ofthe semiconductor fins 23 are spaced apart from each other in the Ydirection. The semiconductor fins 23 may include, for example, silicon,silicon germanium, silicon boride, other suitable materials, or anycombination thereof. In some embodiments, the semiconductor fins 23 maybe made of the same material as the substrate 21; in other embodiments,the semiconductor fins 23 and the substrate 21 may be made of differentmaterials. The gate stacks 24 are formed over the isolation regions 22and the semiconductor fins 23 opposite to the substrate 21 and extend inthe Y direction. Two adjacent ones of the gate stacks 24 are spacedapart from each other in the X direction. In some embodiments, each ofthe gate stacks 24 may be a metal gate stack, and may include a high-kdielectric layer 241, a work function metal layer 242 and a metal filllayer 243. The high-k dielectric layer 241 is conformally formed overthe isolation regions 22 and the semiconductor fins 23. In someembodiments, the high-k dielectric layer 241 may include, but notlimited to, hafnium silicon oxide (HfSiO), hafnium oxide (HfO₂), alumina(Al₂O₃), zirconium oxide (ZrO₂), lanthanum oxide (La₂O₃), titanium oxide(TiO₂), yttrium oxide (Y₂O₃), strontium titanate (SrTiO₃), othersuitable materials, or any combination thereof. The high-k dielectriclayer 241 may be formed using, for example, ALD, CVD or other suitabletechniques. The work function metal layer 242 is conformally formed overthe high-k dielectric layer 241. In some embodiments, the work functionmetal layer 242 may include a p-type semiconductor material, such astitanium nitride (TiN), tantalum nitride (TaN), ruthenium (Ru),molybdenum (Mo), tungsten (W), tungsten nitride (WN), platinum (Pt),zirconium disilicide (ZrSi₂), molybdenum disilicide (MoSi₂), tantalumdisilicide (TaSi₂), nickel disilicide (NiSi₂), other suitable materials,or any combination thereof. Alternatively, the work function metal layer242 may include an n-type semiconductor material, such as titanium (Ti),aluminum (Al), silver (Ag), manganese (Mn), zirconium (Zr), tantalumcarbide (TaC), tantalum carbide nitride (TaCN), tantalum silicon nitride(TaSiN), titanium silicon nitride (TiSiN), other suitable materials, orany combination thereof. The work function metal layer 242 may be formedusing, for example, ALD, CVD, physical vapor deposition (PVD) or othersuitable techniques. The metal fill layer 243 is formed over the workfunction metal layer 242. The metal fill layer 243 may include, but notlimited to, aluminum (Al), tungsten (W), cobalt (Co), other suitablematerials, or any combination thereof. The metal fill layer 243 may beformed by conformally depositing a material for forming the metal filllayer 243 over the work function metal layer 242 using, for example,CVD, PVD, electroless plating or other suitable techniques, followed bya planarization process such as a chemical mechanical polish (CMP)process or other suitable techniques. In some embodiments, each of thegate stacks 24 may further include an interfacial layer 244 disposedbetween the semiconductor fins 23 and the high-k dielectric layer 241.The interfacial layer 244 may include, but not limited to, siliconoxide, silicon oxynitride, other suitable materials, or any combinationthereof. The interfacial layer 244 may be formed using, for example,ALD, CVD, thermal oxidation or other suitable techniques. Oppositesidewalls of each of the gate stacks 24 may be formed with two of thegate spacers 26. The gate spacers 26 may include, but not limited to,silicon oxide, silicon nitride, silicon carbide, silicon oxynitride,other suitable materials, or any combination thereof. The gate spacers26 may be formed using, for example, CVD, ALD or other suitabletechniques, to form a gate spacer layer (not shown) and then etching thegate spacer layer to form the gate spacers 26. Each of the gate stacks24 and two corresponding ones of the gate spacers 26 cooperatively forma gate structure 24A, and thus, the semiconductor structure 20 includesa plurality of the gate structures 24A. The first dielectric layer 25 isformed over the substrate 21. In some embodiments, the first dielectriclayer 25 may include, but not limited to, undoped silicate glass (USG),phosphosilicate glass (PSG), borosilicate glass (BSG), boron-dopedphosphosilicate glass (BPSG), fluorine-doped silicate glass (FSG),silicon dioxide (SiO₂), SiOC-based materials (e.g., SiOCH), othersuitable materials, or any combination thereof. The first dielectriclayer 25 may be formed by conformally depositing a material for formingthe first dielectric layer 25 over the gate stacks 24 and the gatespacers 26 using, for example, spin-on coating, flowable chemical vapordeposition (FCVD), plasma-enhanced chemical vapor deposition (PECVD),low pressure chemical vapor deposition (LPCVD), ALD or other suitabletechniques, followed by a planarization process such as a CMP process orother suitable techniques to expose the gate stacks 24 and the gatespacers 26. As such, the first dielectric layer 25 has a plurality ofdielectric portions 251 to separate the gate structures 24A from eachother. In other words, the dielectric portions 251 are disposed toalternate with the gate stacks 24 or the gate structures 24A in the Xdirection.

FIGS. 6 and 7 are similar to FIGS. 3 and 4, respectively, but illustratethat, after the provision of the semiconductor structure 20, a masklayer 27 is formed on the gate structures 24A and the first dielectriclayer 25. This process is illustrated as process 204 in the flow chart200 shown in FIG. 1. The mask layer 27 may include a first mask sublayer271, a second mask sublayer 272, and a third mask sublayer 273 that aresequentially disposed on the gate structures 24A and the firstdielectric layer 25 in such order. In some embodiments, each of thefirst mask sublayer 271 and the second mask sublayer 272 may be a hardmask, and may include, but not limited to, titanium nitride, siliconoxide, silicon nitride, silicon carbide nitride, silicon oxide nitride,metal oxide (e.g., titanium oxide, aluminum oxide or other suitablematerials), other suitable materials, or any combination thereof. Thefirst mask sublayer 271 and the second mask sublayer 272 may be formedusing, for example, ALD, CVD, PVD or other suitable techniques. In someembodiments, the first mask sublayer 271 and the second mask sublayer272 may include different materials. In some embodiments, the third masksublayer 273 may be a soft mask made of a suitable photoresist material.The third mask sublayer 273 may be formed using, for example, spin-oncoating or other suitable techniques. In some embodiments, the masklayer 27 may only include the first mask sublayer 271 and the third masksublayer 273.

FIGS. 8 and 9 are similar to FIGS. 6 and 7, respectively, but illustratethat, the third mask sublayer 273 is patterned. In addition, FIGS. 10and 11 are similar to FIGS. 8 and 9, but illustrate that the first masksublayer 271, the second mask sublayer 272, and some of the gatestructures 24A are etched through the patterned third mask sublayer 273to form a plurality of trenches 28, each of which may be referred to asa cut metal gate (CMG) trench. This process is illustrated as process206 in the flow chart 200 shown in FIG. 1. In some embodiments, thetrenches 28 penetrate corresponding gate structures 24A shown in FIG. 9,and may extend downwardly to terminate at the isolation region 22 (seeFIGS. 10 and 11). In some embodiments, each trench 28 may be formed byremoving a portion of a corresponding gate stack 24 whilst partiallyremoving the dielectric portions 251 beside the removed portion of thecorresponding gate stack 24. In some embodiments, the process of formingthe trenches 28 may involve (i) exposing and developing the third masksublayer 273 shown in FIGS. 6 and 7 to obtain the patterned third masksublayer 273 shown in FIGS. 8 and 9, (ii) etching the first and secondmask sublayers 271, 272 using the patterned third mask sublayer 273 as amask, and (iii) etching the corresponding gate structures 24A and thefirst dielectric layer 25 shown in FIGS. 8 and 9 using the etched firstand second mask sublayers 271, 272 as a mask to obtain the structureshown in FIGS. 10 and 11. The second mask sublayer 272, the first masksublayer 271, the corresponding gate structures 24A, and the firstdielectric layer 25 may be etched by a suitable etching technique, suchas wet etching, dry etching, or a combination thereof. In someembodiments, as shown in FIGS. 10 and 11, a cross-section of each of thetrenches 28 may be formed in a rectangular shape, but other geometries(e.g., an inverted trapezoid shape) for the trenches 28 are also withinthe scope of the disclosure. In some embodiments, for each of thetrenches 28, the etching rate for the corresponding gate structure 24Amay be higher than that for the first dielectric layer 25, and thetrench 28 may therefore have a deeper center portion at a positioncorresponding to the corresponding gate structure 24A and a shallowerside portion at positions corresponding to the first dielectric layer25. In some embodiments, each of the trenches 28 is formed in thecorresponding gate stack 24 to partition the corresponding gate stack 24into at least two stack sections 24B, and one of which is disposed overa group of the semiconductor fins 23 and the other of which is disposedover another group of the semiconductor fins 23. For example, the gatestack 24 shown in FIG. 10 is partitioned into three stack sections 24Bby the trenches 28, where each stack section 24B may independentlycontrol the semiconductor fins 23 wrapped thereby.

FIG. 12 is a schematic top view similar to FIG. 2 but illustrating that,after the formation of the trenches 28, the mask layer 27 shown in FIGS.10 and 11 is removed. FIGS. 13 and 14 are respectively similar to FIGS.10 and 11, but are cross-sectional views taken along line A-A in the Ydirection and line B-B in the X direction of FIG. 12, respectively. Thisprocess is illustrated as process 208 in the flow chart 200 shown inFIG. 1. The mask layer 27 may be removed using, for example, dryetching, wet etching, CMP or other suitable techniques. In someembodiments, as shown in FIG. 12, a top view of each of the trenches 28may be in a rectangular shape with four rounded corners, but othergeometries for top edges of the trenches 28 are also within the scope ofthe disclosure. In some embodiments, each of the trenches 28 has alength (L) (as shown in FIG. 12) ranging from about 20 nm to about 30nm, but other range values for the length (L) are also within the scopeof the disclosure. In some embodiments, each of the trenches 28 has awidth (W) (as shown in FIG. 12) ranging from about 10 nm to about 20 nm,but other range values are also within the scope of the disclosure. Insome embodiments, each of the trenches 28 has a depth (D) (see FIGS. 13and 14) ranging from about 100 nm to about 200 nm, but other rangevalues for the depth (D) are also within the scope of the disclosure.

FIGS. 15 and 16 are similar to FIGS. 13 and 14, but illustrate that,after the removal of the mask layer 27, a refill dielectric layer 29 isformed on top surfaces of the gate structures 24A, top surfaces of thedielectric portions 251, and fills the trenches 28. This process isillustrated as process 210 in the flow chart 200 shown in FIG. 1. Insome embodiments, the refill dielectric layer 29 may be made of anoxygen free dielectric material to alleviate oxidation of the gatestacks 24. In some embodiments, the refill dielectric layer 29 may bemade of silicon mononitride (SiN), silicon carbon nitride (SiCN),silicon carbide (SiC), metal nitride, other suitable materials, or anycombination thereof. In some embodiments, the refill dielectric layer 29is formed using, for example, CVD, PVD or other suitable techniques. Therefill dielectric layer 29 may have a thickness (T) in a Z direction onthe gate structures 24A and the top surfaces of the dielectric portions251, and dimensions (D1, D2) in the Y direction and dimensions (D3, D4)in the X direction in the trenches 28. The Z direction is normal to boththe X and Y directions. The dimensions (D1, D2) correspond to the widths(W) of the trenches 28 in the Y direction (shown in FIG. 12). Thedimensions (D3, D4) correspond to the lengths (L) of the trenches 28 inthe X direction (shown in FIG. 12). In some embodiments, the thickness(T) is greater than one half of a maximum one of the dimensions (D1 toD4). In some embodiments, the refill dielectric layer 29 may fill thetrenches 28 in a non-conformal manner, and an air gap 30 may thus beformed in the refill dielectric layer 29 in each trench 28. In someembodiments, the air gap 30 may occupy about 10% to about 90% of thevolume of the corresponding trench 28. In some embodiments, the air gap30 includes an upper gap portion 301, a lower gap portion 302 oppositeto the upper gap portion 301 in the Z direction, and a middle gapportion 303 between the upper and lower gap portions 301, 302. In someembodiments, a width (W1) of the lower gap portion 302 in the X or Ydirection is greater than that of the upper gap portion 301. In thisprocess, the semiconductor structure 20 may be clamped by anelectrostatic chuck (E-chuck). When process 210 in the flow chart 200shown in FIG. 1 is performed, by rotating the E-chuck, the semiconductorstructure 20 would undergo a rotation such that the refill dielectriclayer 29 may non-conformally fill the trenches 28 so as to form the airgaps 30.

FIGS. 17 and 18 are similar to FIGS. 15 and 16, but illustrate that,after the formation of the refill dielectric layer 29, an excess of therefill dielectric layer 29 on the top surfaces of the gate structures24A and the first dielectric layer 25 is removed to form refillisolations 291 respectively in the trenches 28. This process isillustrated as process 212 in the flow chart 200 shown in FIG. 1. Insome embodiments, the refill dielectric layer 29 on the top surface ofthe gate structures 24A and the first dielectric layer 25 may be removedusing, for example, CMP or other suitable techniques, without exposingthe air gaps 30. In some embodiments, the refill isolations 291 may bein contact with the isolation regions 22.

FIGS. 19 and 20 are similar to FIGS. 17 and 18, but illustrate that,after the removal of the excess of the refill dielectric layer 29, afirst etch stop layer 31 is formed on the gate structures 24A, the firstdielectric layer 25, and the refill isolations 291 using, for example,CVD or other suitable techniques. The first etch stop layer 31 mayinclude, for example, metal nitride, metal oxide, metal carbide, siliconnitride, silicon oxide, silicon carbide, any combination thereof orother suitable materials. The first etch stop layer 31 may be formedusing, for example, CVD, PECVD, ALD, spin-on coating, electrolessplating or other suitable techniques.

FIG. 21 illustrates a semiconductor structure 20 in accordance with someembodiments. FIG. 21 is similar to FIG. 19 but illustrates that the airgap 30 may be formed in an ellipse shape. In some embodiments, a width(W2) of the middle gap portion 303 in the X or Y direction is greaterthan that of each of the upper and lower gap portions 301, 302. Inaddition, each of the isolation regions 22 may include multipledielectric layers 221, 222, 223, and the layer 222 may be a liner oxidelayer 222 disposed between the dielectric layer 221 and a correspondingone of the semiconductor fins 23. In some embodiments, each trench 28may extend downwardly through a corresponding isolation region 22 toterminate at the substrate 21, as shown in FIG. 21.

FIG. 22 illustrates a semiconductor structure 20 in accordance with someembodiments. FIG. 22 is similar to FIG. 19 but illustrates that each airgap 30 may be formed in a water drop shape.

FIG. 23 illustrates that, after the formation of the first etch stoplayer 31, an interconnect feature 32 is formed on the first etch stoplayer 31 opposite to the substrate 21. This process is illustrated asprocess 214 in the flow chart 200 shown in FIG. 1. The interconnectfeature 32 may include a second dielectric layer 33, a second etch stoplayer 34, a third dielectric layer 35, via contacts 36, a third etchstop layer 37, a fourth dielectric layer 38, first metal contacts 39, afourth etch stop layer 40, a fifth dielectric layer 41, second metalcontacts 42, a fifth etch stop layer 43, a sixth dielectric layer 44,and third metal contacts 45. The process of forming the interconnectfeature 32 is described as follows.

The second dielectric layer 33 is formed on the first etch stop layer 31opposite to the substrate 21. The second dielectric layer 33 mayinclude, for example, USG, PSG, BSG, BPSG, FSG, SiO₂, SiOC-basedmaterials (e.g., SiOCH) or other suitable materials. The seconddielectric layer 33 may be formed using, for example, spin-on coating,FCVD, PECVD, LPCVD, ALD or other suitable techniques. After theformation of the second dielectric layer 33, the second etch stop layer34 is formed on the second dielectric layer 33 opposite to the firstetch stop layer 31. The second etch stop layer 34 may include, forexample, metal nitride, metal oxide, metal carbide, silicon nitride,silicon oxide, silicon carbide, any combination thereof or othersuitable materials. The second etch stop layer 34 may be formed using,for example, CVD, PECVD, ALD, spin-on coating, electroless plating orother suitable techniques. After the formation of the second etch stoplayer 34, the third dielectric layer 35 is formed on the second etchstop layer 34 opposite to the second dielectric layer 33. The thirddielectric layer 35 may include, for example, USG, PSG, BSG, BPSG, FSG,SiO₂, SiOC-based materials (e.g., SiOCH) or other suitable materials.The third dielectric layer 35 may be formed using, for example, spin-oncoating, FCVD, PECVD, LPCVD, ALD or other suitable techniques. After theformation of the third dielectric layer 35, the third dielectric layer35, the second etch stop layer 34, the second dielectric layer 33, andthe first etch stop layer 31 are etched to form a plurality of firstopenings (not shown). In some embodiments, the third dielectric layer35, the second etch stop layer 34, the second dielectric layer 33, andthe first etch stop layer 31 may be etched using, for example, dryetching (e.g., using plasma containing H₂, N₂, NH₃, O₂, CxFx or othersuitable materials) or other suitable techniques, so as to form thefirst openings. After the formation of the first openings, the viacontacts 36 are respectively formed in the first openings. The viacontacts 36 are electrically connected to the gate stacks 24. The viacontacts 36 may include, for example, cobalt, tungsten, copper,titanium, tantalum, aluminum, zirconium, hafnium, any combinationthereof or other suitable materials. The via contacts 36 may be formedby filling the first openings using, for example, CVD, ALD, electrolessplating or other suitable techniques, followed by a planarizationprocess such as CMP or other suitable processes. The first etch stoplayer 31 and the second etch stop layer 34 may respectively serve as anetch stop layer during formation of openings (not shown) in the secondand third dielectric layers 33, 35. After formation of the via contacts36, the third etch stop layer 37 is formed on the third dielectric layer35 and the via contacts 36. The third etch stop layer 37 may include,for example, metal nitride, metal oxide, metal carbide, silicon nitride,silicon oxide, silicon carbide, any combination thereof or othersuitable materials. The third etch stop layer 37 may be formed using,for example, CVD, PECVD, ALD, spin-on coating, electroless plating orother suitable techniques. After the formation of the third etch stoplayer 37, the fourth dielectric layer 38 is formed on the third etchstop layer 37 opposite to the third dielectric layer 35. The fourthdielectric layer 38 may include, for example, silicon oxide, siliconnitride, silicon carbide, silicon oxycarbide, silicon oxynitride,silicon carbonitride, silicon oxycarbonitride, any combination thereofor other suitable materials. The fourth dielectric layer 38 may beformed using, for example, spin-on coating, FCVD, PECVD, LPCVD, ALD orother suitable techniques. After the formation of the fourth dielectriclayer 38, the fourth dielectric layer 38 and the third etch stop layer37 are etched to form a plurality of second openings (not shown). Insome embodiments, the fourth dielectric layer 38 and the third etch stoplayer 37 may be etched using, for example, dry etching (e.g., usingplasma containing H₂, N_(z), NH₃, O₂, CxFx or other suitable gases) orother suitable techniques, so as to form the second openings. After theformation of the second openings, the first metal contacts 39 arerespectively formed in the second openings. The first metal contacts 39are electrically connected to the via contacts 36, respectively. Thefirst metal contacts 39 may include, for example, copper, aluminum,tungsten, cobalt, ruthenium, molybdenum, silver, gold, any combinationthereof, or other suitable materials. The first metal contacts 39 may beformed by filling the second openings using, for example, PVD, CVD,electroless plating, electroplating or other suitable techniques,followed by a planarization process such as CMP or other suitableprocesses. After the formation of the first metal contacts 39, thefourth etch stop layer 40 is formed on the fourth dielectric layer 38and the first metal contacts 39. The fourth etch stop layer 40 mayinclude, for example, metal nitride, metal oxide, metal carbide, siliconnitride, silicon oxide, silicon carbide, any combination thereof orother suitable materials. The fourth etch stop layer 40 may be formedusing, for example, CVD, PECVD, ALD, spin-on coating, electrolessplating or other suitable techniques. After the formation of the fourthetch stop layer 40, the fifth dielectric layer 41 is formed on thefourth etch stop layer 40 opposite to the fourth dielectric layer 38.The fifth dielectric layer 41 may include, for example, silicon oxide,silicon nitride, silicon carbide, silicon oxycarbide, siliconoxynitride, silicon carbonitride, silicon oxycarbonitride, anycombination thereof or other suitable materials. The fifth dielectriclayer 41 may be formed using, for example, spin-on coating, FCVD, PECVD,LPCVD, ALD or other suitable techniques. After the formation of thefifth dielectric layer 41, the fifth dielectric layer 41 and the fourthetch stop layer 40 are etched to form a plurality of third openings (notshown). In some embodiments, the fifth dielectric layer 41 and thefourth etch stop layer 40 may be etched using, for example, dry etching(e.g., using plasma containing H₂, N₂, NH₃, O₂, CxFx or other suitablegases) or other suitable techniques, so as to form the third openings.After the formation of the third openings, the second metal contacts 42are respectively formed in the third openings. The second metal contacts42 are electrically connected to the first metal contacts 39,respectively. The second metal contacts 42 may include, for example,copper, aluminum, tungsten, cobalt, ruthenium, molybdenum, silver, gold,any combination thereof or other suitable materials. The second metalcontacts 42 may be formed by filling the third openings using, forexample, PVD, CVD, electroless plating, electroplating or other suitabletechniques, followed by a planarization process such as CMP or othersuitable processes. After the formation of the second metal contacts 42,the fifth etch stop layer 43 is formed on the fifth dielectric layer 41and the second metal contacts 42. The fifth etch stop layer 43 mayinclude, for example, metal nitride, metal oxide, metal carbide, siliconnitride, silicon oxide, silicon carbide, any combination thereof orother suitable materials. The fifth etch stop layer 43 may be formedusing, for example, CVD, PECVD, ALD, spin-on coating, electrolessplating or other suitable techniques. After the formation of the fifthetch stop layer 43, the sixth dielectric layer 44 is formed on the fifthetch stop layer 43 opposite to the fifth dielectric layer 41. The sixthdielectric layer 44 may include, for example, silicon oxide, siliconnitride, silicon carbide, silicon oxycarbide, silicon oxynitride,silicon carbonitride, silicon oxycarbonitride, any combination thereofor other suitable materials. The sixth dielectric layer 44 may be formedusing, for example, spin-on coating, FCVD, PECVD, LPCVD, ALD or othersuitable techniques. After the formation of the sixth dielectric layer44, the sixth dielectric layer 44 and the fifth etch stop layer 43 areetched to form a plurality of fourth openings (not shown). In someembodiments, the sixth dielectric layer 44 and the fifth etch stop layer43 may be etched using, for example, dry etching (e.g., using plasmacontaining H₂, N₂, NH₃, O₂, CxFx or other suitable gases) or othersuitable techniques, so as to form the fourth openings. After theformation of the fourth openings, the third metal contacts 45 arerespectively formed in the fourth openings to obtain the interconnectfeature 32. The third metal contacts 45 are electrically connected tothe second metal contacts 42, respectively. The third metal contacts 45may include, for example, copper, aluminum, tungsten, cobalt, ruthenium,molybdenum, silver, gold, combinations thereof or other suitablematerials. The third metal contacts 45 may be formed by filling thefourth openings using, for example, PVD, CVD, electroless plating,electroplating or other suitable techniques, followed by a planarizationprocess such as CMP or other suitable processes.

FIGS. 24 and 25 are similar to FIGS. 13 and 14, respectively, butillustrate that, in some embodiments, after the mask layer 27 is removed(i.e., process 208 in the flow chart 200 shown in FIG. 1), with respectto each trench 28, a sacrificial layer 46 may be formed to partiallyfill the trench 28. The sacrificial layer 46 may include, but notlimited to, polyurea-containing material, acrylate-containing material,carboxylate-containing material, other thermal degradable materials,other ultraviolet (UV) degradable materials, combinations thereof orother suitable materials. The sacrificial layer 46 may be formed using,for example, ALD, CVD, molecular layer deposition (MLD), spin-on coatingor other suitable techniques.

FIGS. 26 and 27 are similar to FIGS. 24 and 25, respectively, butillustrate that, after the formation of the sacrificial layers 46 in thetrenches 28 (see FIGS. 24 and 25), a porous dielectric layer 47 isformed on the sacrificial layers 46 to fill the trenches 28. The porousdielectric layer 47 may be formed using, for example, CVD, PVD or othersuitable techniques.

FIGS. 28 and 29 are similar to FIGS. 26 and 27, respectively, butillustrate that, after the formation of the porous dielectric layer 47,an excess of the porous dielectric layer 47 on the top surface of thegate stacks 24 and the first dielectric layer 25 is removed and thusporous dielectric portions 471 are formed to respectively cover thesacrificial layers 46 in the trenches 28 (see FIGS. 24 and 25). Theexcess of the porous dielectric layer 47 may be removed by a suitabletechnique, such as CMP or other suitable techniques.

FIGS. 30 and 31 are similar to FIGS. 28 and 29, respectively, butillustrate that, after the removal of the excess of the porousdielectric layer 47 (see FIGS. 26 and 27), the sacrificial layers 46shown in FIGS. 28 and 29 are removed, so as to obtain the air gaps 30.The sacrificial layers 46 may be removed by diffusing materials of thesacrificial layers 46 through porous structures formed in the porousdielectric portions 471. The sacrificial layers 46 may be removed by athermal treatment, an UV treatment, other suitable techniques, orcombinations thereof. Afterwards, process 214 as shown in FIG. 1 can beperformed. In some embodiments, the porous dielectric layer 47 may serveas a refill isolation and the air gap 30 is formed beneath such refillisolation.

FIG. 32 illustrates a semiconductor structure 20 in accordance with someembodiment, and is similar to a portion of FIG. 17 but no air gap isformed in the refill isolation 291. The refill isolation 291 partitionsa gate stack 24 into two stack sections 24B.

FIG. 33 is similar to FIG. 32 but illustrates that after the refillisolation 291 is formed, a gate replacement process may be used toobtain a semiconductor structure 50. The gate replacement process mayinclude (i) removing dummy gate stacks (not shown, which may includepolysilicon), (ii) depositing materials for forming an interfacial layeron each of the semiconductor fins 23, (iii) sequentially and conformallydepositing materials for forming a high-k dielectric layer, a workfunction metal layer and a metal fill layer, and (iv) conducting aplanarization process, such as CMP or other suitable techniques, toobtain replaced stack sections 51 (two of which are shown in FIG. 33)each including an interfacial layer 544, a high-k dielectric layer 541,a work function metal layer 542 and a metal fill layer 543. Thematerials and techniques for forming the elements 541 to 544 are similarto those for the elements 241 to 244 described above, and the detailsthereof are omitted for the sake of brevity. As shown in FIG. 33, it isnoted that two adjacent metal fill layers 543 of the replaced stacksections 51 are separated from each other by the refill isolation 291,the high-k dielectric layers 541 of the replaced stack sections 51, andthe work function metal layers 542 of the replaced stack sections 51.Nevertheless, referring to FIG. 32, in the semiconductor structure 20(see FIGS. 5 and 15) made by the method of the flow chart 200 shown inFIG. 1, the metal fill layers 243 of two adjacent stack sections 24B areonly separated from one another by the refill isolation 291, therebydecreasing the distance between the metal fill layers 243 of the twoadjacent stack sections 24B and further reducing the overall devicedimension, as compared with the semiconductor structure 50.

In this disclosure, by non-conformally forming a refill dielectric layerin CMG trenches using an oxygen free dielectric material (which may havea high dielectric constant), the refill dielectric portions obtainedfrom the refill dielectric layer can not only prevent oxidation of thegate stacks, but also have the air gaps therein which are useful forreducing overall dielectric constant of a resulting device. Therefore,the overall capacitance of the semiconductor device may be lowered by,for example, about 1% to about 2%.

In accordance with some embodiments, a semiconductor device includes aplurality of semiconductor fins, at least one gate stack, a refillisolation, and an air gap. Each of the semiconductor fins extends in anX direction. Two adjacent ones of the semiconductor fins are spacedapart from each other in a Y direction transverse to the X direction.The at least one gate stack has two stack sections spaced apart fromeach other in the Y direction. The stack sections are disposed over twoadjacent ones of the semiconductor fins, respectively. The refillisolation and the air gap are disposed between the stack sections.

In accordance with some embodiments, the semiconductor device furtherincludes a semiconductor substrate and an isolation structure. Thesemiconductor fins are formed on the semiconductor substrate. Theisolation structure is disposed on the semiconductor substrate amonglower portions of the semiconductor fins. The gate stacks are formedover the semiconductor substrate, the semiconductor fins, and theisolation structure.

In accordance with some embodiments, the refill isolation extendsthrough the isolation structure into the semiconductor substrate.

In accordance with some embodiments, the refill isolation is in contactwith the isolation structure.

In accordance with some embodiments, the air gap is formed inside therefill isolation, and has an upper gap portion, a lower gap portionopposite to the upper gap portion in a Z direction normal to both the Xand Y directions, and a middle gap portion between the upper and lowergap portions. A width of the middle gap portion in the X or Y directionis greater than that of each of the upper and lower gap portions.

In accordance with some embodiments, the air gap is formed inside therefill isolation, and has an upper gap portion and a lower gap portionopposite to the upper gap portion in a Z direction normal to both the Xand Y directions. A width of the lower gap portion in the X or Ydirection is greater than that of the upper gap portion.

In accordance with some embodiments, the air gap is formed beneath therefill isolation.

In accordance with some embodiments, the semiconductor device includes aplurality of the gate stacks. Two adjacent ones of the gate stacks arespaced apart from each other in the X direction.

In accordance with some embodiments, the semiconductor device furtherincludes a plurality of dielectric portions disposed to alternate withthe gate stacks in the X direction.

In accordance with some embodiments, the refill isolation includes anoxygen free dielectric material.

In accordance with some embodiments, a method for making a semiconductordevice includes: forming a plurality of semiconductor fins on asemiconductor substrate, each of the semiconductor fins extending in anX direction, two adjacent ones of the semiconductor fins being spacedapart from each other in a Y direction transverse to the X direction;forming at least one gate stack over the semiconductor fins, the gatestack extending in the Y direction; forming at least one trench in thegate stack to partition the gate stack into two stack sections; andforming a refill isolation in the trench such that an air gap is formedin the trench.

In accordance with some embodiments, the refill isolation is formed bynon-conformally depositing a refill dielectric layer over the gate stackand the trench, and removing an upper portion of the refill dielectriclayer which is formed on the gate stack.

In accordance with some embodiments, the refill dielectric layer isformed using chemical vapor deposition.

In accordance with some embodiments, the semiconductor substrate isrotated when depositing the refill dielectric layer.

In accordance with some embodiments, the upper portion of the refilldielectric layer has a thickness in a Z direction normal to both the Xand Y directions, and the refill dielectric layer has a first dimensionin the trench in the X direction, and a second dimension in the trenchin the Y direction. The thickness of the upper portion of the refilldielectric layer is greater than one half of a larger one of the firstand second dimensions.

In accordance with some embodiments, the method further includes:forming two dielectric portions at two opposite sides of the gate stack.The trench is formed by removing a portion of the gate stack whilstpartially removing the dielectric portions beside the removed portion ofthe gate stack.

In accordance with some embodiments, the trench is formed using anetchant which has a higher etching rate for the gate stack than for thedielectric portions.

In accordance with some embodiments, a method for making a semiconductordevice includes: forming a plurality of semiconductor fins on asemiconductor substrate, each of the semiconductor fins extending in anX direction, two adjacent ones of the semiconductor fins being spacedapart from each other in a Y direction transverse to the X direction;forming a plurality of gate stacks over the semiconductor fins, each ofthe gate stacks extending in the Y direction, two adjacent ones of thegate stacks being spaced apart from each other in the X direction;forming at least one trench in at least one of the gate stacks topartition the at least one of the gate stacks into two stack sectionsone of which is disposed over a group of the semiconductor fins and theother of which is disposed over another group of the semiconductor fins;and forming a refill isolation and an air gap in the trench.

In accordance with some embodiments, the refill isolation and the airgap are formed by: non-conformally depositing a refill dielectric layerover the gate stacks and the trench such that the air gap is formed inthe trench inside the refill dielectric layer; and removing an upperportion of the refill dielectric layer which is formed on the gatestacks.

In accordance with some embodiments, the refill isolation and the airgap are formed by: partially filling a sacrificial layer in the trench;forming a porous dielectric layer over the gate stack, the sacrificiallayer and the trench; removing an upper portion of the porous dielectriclayer which is formed on the gate stacks; and removing the sacrificiallayer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1-10. (canceled)
 11. A method for making a semiconductor devicecomprising: forming a plurality of semiconductor fins on a semiconductorsubstrate, each of the semiconductor fins extending in an X direction,two adjacent ones of the semiconductor fins being spaced apart from eachother in a Y direction transverse to the X direction; forming at leastone gate stack over the semiconductor fins, the gate stack extending inthe Y direction; forming at least one trench in the gate stack topartition the gate stack into two stack sections; and forming a refillisolation in the trench such that an air gap is formed in the trench.12. The method as claimed in claim 11, wherein the refill isolation isformed by non-conformally depositing a refill dielectric layer over thegate stack and the trench, and removing an upper portion of the refilldielectric layer which is formed on the gate stack.
 13. The method asclaimed in claim 12, wherein the refill dielectric layer is formed usingchemical vapor deposition.
 14. The method as claimed in claim 12,wherein the semiconductor substrate is rotated when depositing therefill dielectric layer.
 15. The method as claimed in claim 12, whereinthe upper portion of the refill dielectric layer has a thickness in a Zdirection normal to both the X and Y directions, and the refilldielectric layer has a first dimension in the trench in the X direction,and a second dimension in the trench in the Y direction, the thicknessof the upper portion of the refill dielectric layer being greater thanone half of a larger one of the first and second dimensions.
 16. Themethod as claimed in claim 11, further comprising: forming twodielectric portions at two opposite sides of the gate stack, the trenchbeing formed by removing a portion of the gate stack whilst partiallyremoving the dielectric portions beside the removed portion of the gatestack.
 17. The method as claimed in claim 16, wherein the trench isformed using an etchant which has a higher etching rate for the gatestack than for the dielectric portions.
 18. A method for making asemiconductor device, comprising: forming a plurality of semiconductorfins on a semiconductor substrate, each of the semiconductor finsextending in an X direction, two adjacent ones of the semiconductor finsbeing spaced apart from each other in a Y direction transverse to the Xdirection; forming a plurality of gate stacks over the semiconductorfins, each of the gate stacks extending in the Y direction, two adjacentones of the gate stacks being spaced apart from each other in the Xdirection; forming at least one trench in at least one of the gatestacks to partition the at least one of the gate stacks into two stacksections one of which is disposed over a group of the semiconductor finsand the other of which is disposed over another group of thesemiconductor fins; and forming a refill isolation and an air gap in thetrench.
 19. The method as claimed in claim 18, wherein the refillisolation and the air gap are formed by non-conformally depositing arefill dielectric layer over the gate stacks and the trench such thatthe air gap is formed in the trench inside the refill dielectric layer,and removing an upper portion of the refill dielectric layer which isformed on the gate stacks.
 20. The method as claimed claim 18, whereinthe refill isolation and the air gap are formed by partially filling asacrificial layer in the trench, forming a porous dielectric layer overthe gate stack, the sacrificial layer, and the trench, removing an upperportion of the porous dielectric layer which is formed on the gatestacks, and removing the sacrificial layer.
 21. A method for making asemiconductor device, comprising: forming a plurality of semiconductorfins each extending in an X direction, two adjacent ones of thesemiconductor fins being spaced apart from each other in a Y directiontransverse to the X direction; forming at least one gate stack havingtwo stack sections spaced apart from each other in the Y direction, thestack sections being disposed over two adjacent ones of thesemiconductor fins, respectively; and forming a refill isolation and anair gap which are disposed between and separate the stack sections. 22.The method as claimed in claim 21, further comprising: before formationof the semiconductor fins, forming a semiconductor substrate on whichthe semiconductor fins are formed; and after the formation of thesemiconductor fins and before formation of the at least one gate stack,forming an isolation structure disposed on the semiconductor substrateamong lower portions of the semiconductor fins, the at least one gatestack being formed over the semiconductor substrate, the semiconductorfins, and the isolation structure, so that, in the step of forming therefill isolation and the air gap, the refill isolation extends throughthe isolation structure into the semiconductor substrate.
 23. The methodas claimed in claim 22, wherein the refill isolation is formed to be incontact with the isolation structure.
 24. The method as claimed in claim21, wherein the air gap is formed inside the refill isolation, and hasan upper gap portion, a lower gap portion opposite to the upper gapportion in a Z direction normal to both the X and Y directions, and amiddle gap portion between the upper and lower gap portions, a width ofthe middle gap portion in the X or Y direction being greater than thatof each of the upper and lower gap portions.
 25. The method as claimedin claim 21, wherein the air gap is formed inside the refill isolation,and has an upper gap portion and a lower gap portion opposite to theupper gap portion in a Z direction normal to both the X and Ydirections, a width of the lower gap portion in the X or Y directionbeing greater than that of the upper gap portion.
 26. The method asclaimed in claim 21, wherein the air gap is formed beneath the refillisolation.
 27. The method as claimed in claim 21, further comprisingforming two dielectric portions at two opposite sides of the at leastone gate stack, so that, in the step of forming the refill isolation andthe air gap, the refill isolation partially extends into the dielectricportions.
 28. The method as claimed in claim 21, wherein the refillisolation is made from an oxygen free dielectric material.
 29. Themethod as claimed in claim 21, wherein the refill isolation is formed ina non-conformal manner such that the air gap is formed inside the refillisolation.
 30. The method as claimed in claim 21, wherein the step offorming the refill isolation and the air gap includes: forming asacrificial layer and a porous dielectric layer over the sacrificiallayer; removing an upper portion of the porous dielectric layer to formthe refill isolation; and removing the sacrificial layer to form the airgap.